Photosensitive
Polyimide

(PI)

作为具有碱性显影的Positive类型的Photoresist,它具有优异的耐化学性和耐热性。
在OLED元件内起到Bank作用,并具有确保平坦度的功能和高可靠性。

  • Key Features
    • Photosensitive Patternable Polyimide
    • High Thermal Resistance
    • High Resolution
    • High Stability of OLED Devices
    • Good Adhesion (Cross-cut 5B)
    Thickness 2.5~3.0 ㎛
    Exposure Posi-type
    Max. 100 mJ/㎠
    Development TMAH 2.38%
    Resolution 10um (Line Pattern)
    Post-Bake 220 ℃ / 60 min
    Thermal Property Td 5% loss (min 450℃)
  • Photosensitive Polyimide Synthesis Technology

    Control of Various Synthetic Pathways and Properties

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