Key Features
- Photosensitive Patternable Polyimide
- High Thermal Resistance
- High Resolution
- High Stability of OLED Devices
- Good Adhesion (Cross-cut 5B)
作为具有碱性显影的Positive类型的Photoresist,它具有优异的耐化学性和耐热性。
在OLED元件内起到Bank作用,并具有确保平坦度的功能和高可靠性。
Thickness | 2.5~3.0 ㎛ |
Exposure | Posi-type |
Max. 100 mJ/㎠ | |
Development | TMAH 2.38% |
Resolution | 10um (Line Pattern) |
Post-Bake | 220 ℃ / 60 min |
Thermal Property | Td 5% loss (min 450℃) |
Control of Various Synthetic Pathways and Properties